• Lenovo ThinkSystem SR860 V3 – Scalable 4U Rack Server with Up to 4× Intel® Xeon® Scalable CPUs

    Keywords

    [Lenovo ThinkSystem SR860 V3](#Lenovo ThinkSystem SR860 V3), [4th Gen Intel Xeon Scalable](#4th Gen Intel Xeon Scalable), [4-socket server](#4-socket server), [DDR5 memory](#DDR5 memory), [NVMe storage](#NVMe storage), GPU-dense, [PCIe 5.0](#PCIe 5.0), [Lenovo Neptune cooling](#Lenovo Neptune cooling), [XClarity management](#XClarity management), [4U rack server](#4U rack server)

    Description

    The [Lenovo ThinkSystem SR860 V3](#Lenovo ThinkSystem SR860 V3) is a 4U, 4-socket rack server designed for mission-critical workloads—from SAP HANA in-memory computing to AI training and large-scale virtualization Lenovo Press. Powered by up to four 4th Generation Intel® Xeon® Scalable processors (up to 60 cores each, 3.7 GHz) in a mesh topology with three UPI links, it delivers massive parallel compute with up to 480 threads Lenovo Press.

    With 64 DDR5 DIMM slots supporting speeds up to 4800 MT/s and 16 TB total capacity, the SR860 V3 provides the highest memory bandwidth available for data-intensive analytics and in-memory databases Lenovo Press. Its flexible storage architecture offers up to 48× 2.5″ drive bays (24 AnyBay NVMe/SAS/SATA), plus rear 7 mm or M.2 boot drives, eliminating I/O bottlenecks and enabling sub-millisecond response times Lenovo Press.

    For GPU-accelerated workloads, the SR860 V3 supports up to four double-width 350 W GPUs (e.g., NVIDIA A100/H100) or eight single-width 75 W GPUs, with optional Lenovo Neptune™ liquid-to-air hybrid cooling maintaining optimal thermals under full load.

    Enterprise-grade management is delivered via Lenovo XClarity Controller 2 and the XClarity Administrator suite—automating deployment, firmware updates, and health monitoring to reduce provisioning time by up to 95 % Lenovo Press.

    Key Features

    • Up to 4× 4th Gen Intel® Xeon® Scalable CPUs: Mesh topology, 3 UPI links, 240 cores/480 threads max Lenovo Press

    • 16 TB DDR5 Memory: 64 DIMM slots, 4800 MT/s for highest-speed in-memory workloads Lenovo Press

    • Massive GPU Support: Four 350 W double-width or eight 75 W single-width GPUs for AI/HPC acceleration

    • 48× 2.5″ Drive Bays & NVMe AnyBay: Up to 24 direct-attach NVMe drives, eliminating storage bottlenecks

    • Lenovo Neptune™ Cooling: Hybrid liquid-to-air heat exchanger for GPU modules, reducing noise and power

    • PCIe 5.0 & OCP 3.0: Up to 16 Gen5/Gen4 PCIe slots plus two OCP 3.0 for 1–100 GbE networking

    • Lenovo XClarity Management: Embedded XClarity Controller 2, Administrator, Integrator plugins, Redfish API Lenovo Press

    • Enterprise-grade Reliability: Predictive Failure Analysis, light-path diagnostics, RoT/PFR security Lenovo Press

    Configuration

    ComponentSpecification
    Form Factor4U rack, 42.8 × 482.4 × 807 mm
    Processors2–4× 4th Gen Intel® Xeon® Scalable (up to 350 W, 60 cores/CPU, mesh UPI) Lenovo Press
    Memory64× DDR5 slots (64–256 GB TruDDR5 UDIMMs, up to 4800 MT/s, 16 TB max) Lenovo Press
    Drive BaysFront: 48× 2.5″ AnyBay (NVMe/SAS/SATA) or direct NVMe; Rear: 2× 7 mm or 2× M.2 boot SSDs Lenovo Press
    GPU OptionsUp to 4× double-width 350 W GPUs or 8× single-width 75 W GPUs; Lenovo Neptune cooling for HGX modules 
    I/O ExpansionUp to 16× PCIe slots (12× Gen5 + 4× Gen4) or 18× Gen4; 2× OCP 3.0 slots Lenovo Press
    NetworkingOCP 3.0 slots support 1/10/25/100 GbE; optional InfiniBand adapters
    Power Supplies2–4× Titanium/Platinum hot-swap PSUs (N+N redundancy)
    ManagementXClarity Controller 2, XClarity Administrator, Redfish API; LiCO orchestration optional

    Compatibility

    Supports all major OS and hypervisors:

    Usage Scenarios

    • In-Memory Databases (SAP HANA): Mesh-connected CPUs and 16 TB DDR5 accelerate real-time analytics with sub-millisecond latency Lenovo Press.

    • AI Training & Inference: Up to four 350 W GPUs with NVLink and Neptune cooling deliver scalable multi-instance GPU (MIG) performance for deep learning workloads.

    • High-Performance Computing (HPC): 64 DIMMs at 4800 MT/s and PCIe 5.0 I/O maximize throughput for simulations, genomic sequencing, and weather modeling Lenovo Press.

    • Virtualization & VDI: Up to 480 threads and 48 NVMe drives enable high VM density with low boot-storm impact and rapid cloning Lenovo Press.

    Frequently Asked Questions

    Q1: Can the SR860 V3 mix 350 W and 75 W GPUs?
    A1: Yes—you may install up to four double-width 350 W GPUs or up to eight single-width 75 W GPUs, but mixing both widths in the same chassis is not supported.

    Q2: How does the “pay-as-you-grow” CPU upgrade work?
    A2: You can start with two 4th Gen Intel Xeon Scalable CPUs and add a customer-installable mezzanine tray to upgrade to four CPUs and 64 DIMMs without downtime Lenovo Press.

    Q3: What cooling options exist for GPU modules?
    A3: Lenovo Neptune™ liquid-to-air hybrid cooling is available for HGX GPU modules, offering up to 30 % lower acoustic noise and 20 % energy savings over air-only cooling.

    Q4: Which RAID options are supported?
    A4: The SR860 V3 supports ThinkSystem PCIe RAID/HBA cards as well as CPU-based VROC for RAID 0/1 boot volumes; hardware RAID controllers are required for data drives Lenovo Documentation.

    Q5: What network fabrics can be deployed?
    A5: Two OCP 3.0 slots can host adapters for 1/10/25/100 GbE, InfiniBand EDR/HDR, or iWARP, enabling flexible cluster interconnects and low-latency storage fabrics Lenovo Press.

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